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 HD74LVC16245A
16-bit Bus Transceivers with 3-state Outputs
REJ03D0365-0400Z (Previous ADE-205-120B(Z)) Rev.4.00 Jul. 29, 2004
Description
The HD74LVC16245A has sixteen two direction buffers, for the fittest at two direction bus lines with three state outputs. A direction control input, DIR. When DIR is high, data flows from the A inputs to the B outputs. When DIR is low, data flows from the B inputs to the A outputs. When enable inputs (G) is high, disables both A and B ports by placing then in a high impedance. Low voltage and high-speed operation is suitable at the battery drive product (note type personal computer) and low power consumption extends the life of a battery for long time operation.
Features
* * * * * * * VCC = 2.0 V to 5.5 V All inputs VIH (Max.) = 5.5 V (@VCC = 0 V to 5.5 V) All outputs VOUT (Max.) = 5.5 V (@VCC = 0 V or output off state) Typical VOL ground bounce < 0.8 V (@VCC = 3.3 V, Ta = 25C) Typical VOH undershoot > 2.0 V (@VCC = 3.3 V, Ta = 25C) High output current 24 mA (@VCC = 3.0 V to 5.5 V) Ordering Information
Package Type TSSOP-48 pin Package Code TTP-48DBV Package Abbreviation T Taping Abbreviation (Quantity) EL (1,000 pcs/reel)
Part Name HD74LVC16245ATEL
Function Table
Inputs G L L H H: L: X: Z: High level Low level Immaterial High impedance DIR L H X Operation B data to A bus A data to B bus Z
Rev.4.00 Jul. 29, 2004 page 1 of 7
HD74LVC16245A
Pin Arrangement
1DIR 1 1B1 2 1B2 3 GND 4 1B3 5 1B4 6 VCC 7 1B5 8 1B6 9 GND 10 1B7 11 1B8 12 2B1 13 2B2 14 GND 15 2B3 16 2B4 17 VCC 18 2B5 19 2B6 20 GND 21 2B7 22 2B8 23 2DIR 24
48 1G 47 1A1 46 1A2 45 GND 44 1A3 43 1A4 42 VCC 41 1A5 40 1A6 39 GND 38 1A7 37 1A8 36 2A1 35 2A2 34 GND 33 2A3 32 2A4 31 VCC 30 2A5 29 2A6 28 GND 27 2A7 26 2A8 25 2G
(Top view)
Rev.4.00 Jul. 29, 2004 page 2 of 7
HD74LVC16245A
Absolute Maximum Ratings
Item Supply voltage Input diode current Input voltage Output diode current Input / Output voltage Output current VCC, GND current / pin Storage temperature Symbol VCC IIK VI IOK VI/O IO ICC or IGND Tstg Ratings -0.5 to 6.0 -50 -0.5 to 6.0 -50 50 -0.5 to VCC +0.5 -0.5 to 6.0 50 100 -65 to +150 Unit V mA V mA V mA mA C Conditions VI = -0.5 V G, DIR VO = -0.5 V VO = VCC+0.5 V Output "H" or "L" Output "Z" or VCC:OFF
Note: The absolute maximum ratings are values, which must not individually be exceeded, and furthermore, no two of which may be realized at the same time.
Recommended Operating Conditions
Item Supply voltage Input / output voltage Symbol VCC VI VI/O Ta IOH IOL Input rise / fall time *1 tr, tf Ratings 1.5 to 5.5 2.0 to 5.5 0 to 5.5 0 to VCC 0 to 5.5 -40 to 85 -12 -24*2 12 24*2 10 Unit V V V C mA mA ns/V Conditions Data retention At operation G, DIR Output "H" or "L" Output "Z" or VCC:OFF VCC = 2.7 V VCC = 3.0 V to 5.5 V VCC = 2.7 V VCC = 3.0 V to 5.5 V
Operating temperature Output current
Notes: 1. This item guarantees maximum limit when one input switches.
Waveform: Refer to test circuit of switching characteristics.
2. Duty cycle 50%
Rev.4.00 Jul. 29, 2004 page 3 of 7
HD74LVC16245A
Electrical Characteristics
Ta = -40 to 85C Item Input voltage Symbol VIH VIL Output voltage VOH VCC (V) 2.7 to 3.6 4.5 to 5.5 2.7 to 3.6 4.5 to 5.5 2.7 to 5.5 2.7 3.0 3.0 4.5 2.7 to 5.5 2.7 3.0 4.5 0 to 5.5 2.7 to 5.5 0 2.7 to 3.6 2.7 to 5.5 3.0 to 3.6 Min 2.0 VCCx0.7 -- -- VCC-0.2 2.2 2.4 2.2 3.8 -- -- -- -- -- -- -- -- -- -- Max -- -- 0.8 VCCx0.3 -- -- -- -- -- 0.2 0.4 0.55 0.55 5.0 5.0 20 20 20 500 Unit V V V IOH = -100 A IOH = -12 mA IOH = -24 mA V IOL = 100 A IOL = 12 mA IOL = 24 mA VIN = 5.5 V or GND VIN = VCC, GND VOUT = 5.5 V or GND VIN / VOUT = 5.5 V VIN / VOUT = 3.6 to 5.5 V VIN = VCC or GND VIN = one input at(VCC-0.6)V, other inputs at VCC or GND Test Conditions
VOL
Input current Off state output current Output leak current Quiescent supply current
IIN IOZ IOFF ICC ICC
A A A A A
Switching Characteristics
Ta = -40 to 85C Item Propagation delay time Symbol tPLH tPHL tZH tZL tHZ tLZ VCC (V) 2.7 3.30.3 5.00.5 2.7 3.30.3 5.00.5 2.7 3.30.3 5.00.5 2.7 3.30.3 5.00.5 2.7 2.7 Min -- 1.5 -- -- 1.5 -- -- 1.5 -- -- -- -- -- -- Typ -- -- -- -- -- -- -- -- -- -- -- -- 3.0 15.0 Max 5.8 5.2 4.5 8.0 7.2 6.0 8.0 7.2 6.0 -- 1.0 1.0 -- -- Unit ns From (Input) A or B To (Output) B or A
Output enable time
ns
G
B or A
Output disable time
ns
G
B or A
Between output pins skew tOSLH *1 tOSHL Input capacitance Output capacitance Note: CIN CO
ns
pF pF
1. This parameter is characterized but not tested.
tosLH = | tPLHm - tPLHn |, tosHL = | tPHLm - tPHLn |
Rev.4.00 Jul. 29, 2004 page 4 of 7
HD74LVC16245A
Test Circuit
VCC VCC
G Output A1 S1 500 S2 B1 CL = 50 pF 450 50 Scope OPEN
*1 See under table
Input
Pulse generator Zout = 50
See Function Table
GND
DIR Symbol t PLH / t PHL t ZH/ t HZ t ZL / t LZ S2
Vcc=2.7V, 3.30.3V Vcc=5.00.5V
OPEN GND 6V
OPEN GND 2xVcc
Notes:
1. CL includes probe and jig capacitance. 2. A2-B2 to A8-B8 are identical to above load circuit. 3. S1 : Input-Output change switch.
Waveforms - 1
tr 90 % Input Vref 10 % t PLH Vref 90 % Vref 10 % t PHL VOH Output Vref VOL tf VIH GND
Notes:
1. tr = 2.5 ns, tf = 2.5 ns 2. Input waveform : PRR = 10 MHz, duty cycle 50%
Rev.4.00 Jul. 29, 2004 page 5 of 7
HD74LVC16245A Waveforms - 2
tf G 90 % Vref 10 % t ZL Waveform - A t ZH Waveform - B Vref Vref t HZ VOH - 0.3 V tr 90 % Vref 10 % t LZ VIH GND V OH1 VOL + 0.3 V VOL VOH V OL1 TEST VIH Vref VOH1 VOL1
Vcc=2.7V, 3.30.3V Vcc=5.00.5V
2.7 V 1.5 V 3V GND
Vcc 50%Vcc Vcc GND
Notes:
1. tr = 2.5 ns, tf = 2.5 ns 2. Input waveform : PRR = 10 MHz, duty cycle 50% 3. Waveform - A shows input conditions such that the output is "L" level when enable by the output control. 4. Waveform - B shows input conditions such that the output is "H" level when enable by the output control.
Rev.4.00 Jul. 29, 2004 page 6 of 7
HD74LVC16245A
Package Dimensions
As of January, 2002
12.5 12.7 Max 48 25
Unit: mm
1 *0.19 0.05
0.50
24
0.08 M 8.10 0.20 0 - 8
6.10
1.0
0.65 Max
*0.15 0.05
0.10
0.10 0.05
1.20 Max
0.50 0.1
*Pd plating
Package Code JEDEC JEITA Mass (reference value)
TTP-48DBV -- -- 0.20 g
Rev.4.00 Jul. 29, 2004 page 7 of 7
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500 Fax: <1> (408) 382-7501 Renesas Technology Europe Limited. Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, United Kingdom Tel: <44> (1628) 585 100, Fax: <44> (1628) 585 900 Renesas Technology Europe GmbH Dornacher Str. 3, D-85622 Feldkirchen, Germany Tel: <49> (89) 380 70 0, Fax: <49> (89) 929 30 11 Renesas Technology Hong Kong Ltd. 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2375-6836 Renesas Technology Taiwan Co., Ltd. FL 10, #99, Fu-Hsing N. Rd., Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. 26/F., Ruijin Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1, Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001
http://www.renesas.com
(c) 2004. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .1.0


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